Patent Number: 8,877,566

Title: Curvilinear heat spreader/lid with improved heat dissipation

Abstract: A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.

Inventors: Gaynes; Michael A. (Vestal, NY), McGlashan-Powell; Maurice (Mount Vernon, NY), Park; Soojae (Wappingers Falls, NY), Yarmchuk; Edward J. (Mahopac, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/00 (20060101)

Expiration Date: 2019-11-04 0:00:00