Patent Number: 8,877,652

Title: Substrate structure and method of manufacturing the same

Abstract: A substrate structure and method of manufacturing the same are disclosed. The substrate structure may includes a substrate on which a plurality of protrusions are formed on one surface thereof and a plurality of buffer layers formed according to a predetermined pattern and formed spaced apart from each other on the plurality of protrusions.

Inventors: Kim; Jun-youn (Hwaseong-si, KR), Chae; Su-hee (Suwon-si, KR), Hong; Hyun-gi (Suwon-si, KR), Tak; Young-jo (Hwaseong-si, KR)

Assignee: Samsung Electronics Co., Ltd.

International Classification: H01L 33/12 (20100101)

Expiration Date: 2019-11-04 0:00:00