Patent Number: 8,877,697

Title: Cleaning agent for removal of, removal method for, and cleaning method for water-soluble, lead-free solder flux

Abstract: An object of this invention is to provide a cleaner for the removal of water-soluble, lead-free soldering flux, the cleaner capable of cleaning off, in a short period of time, water-soluble flux residues generated during soldering with lead-free solder using water-soluble flux, the cleaner further having excellent dissolution property as well as excellent narrow gap cleaning property. The cleaner for removing water-soluble, lead-free soldering flux of the present invention comprises 5 to 100 parts by weight of a glycol ether compound (A) per 100 parts by weight of water.

Inventors: Tanaka; Takashi (Osaka, JP), Tanaka; Keita (Osaka, JP), Morino; Yoshinobu (Osaka, JP)

Assignee: Arakawa Chemical Industries, Ltd.

International Classification: C11D 7/50 (20060101)

Expiration Date: 2019-11-04 0:00:00