Patent Number: 8,877,866

Title: Curable epoxy resin compositions having improved adhesion to metal substrates and processes for making and using the same

Abstract: Thermosettable compositions are described having improved adhesion to metal substrates when cured comprising (a) at least one curable epoxy resin; (b) at least one hardener, each hardener having less than 1 primary amine group per molecule and not more than 1 secondary amine group per molecule, the hardener(s) comprising at least one polyhydroxy hydrocarbon, hydrocarbon capable of generating multiple hydroxy groups per molecule during curing of the thermosettable material, or poly(acid anhydride)hydrocarbon other than a blend of (1) a copolymer of an ethylenically unsaturated anhydride and a vinyl compound and (2) a copolymer of an ethylenically unsaturated anhydride and an elastomer, and (c) at least one triblock copolymer comprising at least one elastomeric block and at least one acrylic block. Processes for making a coated article, a fiber-reinforced composite article, prepregs and laminates using the thermosettable compositions are also described, which are useful for making coated articles, fiber-reinforced composites, prepregs, laminates and printed wiring boards.

Inventors: Carson; Terri J. (Greensboro, NC), Valette; Ludovic (Shanghai, CN)

Assignee: Dow Global Technologies LLC

International Classification: B05D 3/02 (20060101); B29C 65/02 (20060101); B32B 17/02 (20060101); B32B 37/10 (20060101); C08L 33/02 (20060101); C08L 61/10 (20060101); C08L 63/04 (20060101)

Expiration Date: 2019-11-04 0:00:00