Patent Number: 8,877,877

Title: Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material

Abstract: A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure, ##STR00001##

Inventors: Koh; Sang-Ran (Uiwang-si, KR), Shin; June-Ho (Uiwang-si, KR), Kim; Woo-Han (Uiwang-si, KR), Cha; Sung-Hwan (Uiwang-si, KR), Ahn; Hyun-Jung (Uiwang-si, KR)

Assignee: Cheil Industries, Inc.

International Classification: C08G 77/38 (20060101); C08L 83/04 (20060101); C08L 83/07 (20060101); C08L 83/05 (20060101)

Expiration Date: 2019-11-04 0:00:00