Patent Number: 8,878,070

Title: Wiring board and method of manufacturing a semiconductor device

Abstract: A wiring board of this invention includes a product formation area in which are arranged a plurality of product formation sections on which a semiconductor chip is mounted; a molding area that is provided on an outer circumferential side of the product formation area, and with which a seal portion that covers the semiconductor chips mounted on the product formation sections makes contact; a clamp area that is provided on an outer circumferential side of the molding area, and that is held by a molding die that forms the seal portion; wiring that is provided in the product formation area, and that is electrically connected to the semiconductor chips; a first solid pattern that is provided in the molding area, and in which a plurality of dots are arranged; and a second solid pattern that is provided in the clamp area, and in which a plurality of dots that are larger than the dots of the first solid pattern are arranged.

Inventors: Kashiwaya; Emi (Tokyo, JP), Kindo; Osamu (Tokyo, JP), Shimada; Noriou (Tokyo, JP)

Assignee: PS4 Luxco S.A.R.L.

International Classification: H05K 1/00 (20060101)

Expiration Date: 2019-11-04 0:00:00