Patent Number: 8,878,326

Title: Imager microlens structure having interfacial region for adhesion of protective layer

Abstract: Structures and design structures for improved adhesion of protective layers of imager microlens structures are disclosed. A method of fabricating a semiconductor structure includes forming an interfacial region between a microlens and a protective oxide layer. The interfacial region has a lower concentration of oxygen than the protective oxide layer.

Inventors: Cooney, III; Edward C. (Jericho, VT), Gambino; Jeffrey P. (Westford, VT), Leidy; Robert K. (Burlington, VT), Musante; Charles F. (South Burlington, VT), Twombly; John G. (Essex Junction, VT)

Assignee: International Business Machines Corporation

International Classification: H01L 31/0232 (20140101)

Expiration Date: 2019-11-04 0:00:00