Patent Number: 8,878,345

Title: Structural body and method for manufacturing semiconductor substrate

Abstract: A structural body includes a sapphire underlying substrate; and a semiconductor layer of a group III nitride semiconductor disposed on the underlying substrate. An upper surface of the underlying substrate is a crystal surface tilted at an angle of 0.5.degree. or larger and 4.degree. or smaller with respect to a normal line of an a-plane which is orthogonal to an m-plane and belongs to a {11-20} plane group, from the m-plane which belongs to a {1-100} plane group.

Inventors: Yao; Takafumi (Tsukuba, JP), Lee; Hyun-Jae (Gimpo Si, KR), Fujii; Katsushi (Tondabayashi, JP)

Assignee: AETech Corporation

International Classification: H01L 21/20 (20060101); H01L 29/04 (20060101)

Expiration Date: 2019-11-04 0:00:00