Patent Number: 8,878,349

Title: Semiconductor chip and stacked semiconductor package having the same

Abstract: A semiconductor chip includes a semiconductor substrate having one surface, an other surface which faces away from the one surface, and through holes which pass through the one surface and the other surface; through electrodes filled in the through holes; and a gettering layer formed of polysilicon interposed between the through electrodes and inner surfaces of the semiconductor substrate whose form is defined by the through holes.

Inventors: Lee; Gyu Jei (Seoul, KR), Lee; Kang Won (Icheon-si, KR), Kim; Hyun Joo (Icheon-si, KR)

Assignee: SK Hynix Inc.

International Classification: H01L 23/20 (20060101)

Expiration Date: 2019-11-04 0:00:00