Patent Number: 8,879,261

Title: Heat-dissipating device for electronic apparatus

Abstract: A heat-dissipating device for an electronic apparatus can include: a thermal base coupled to a first electronic component in such a manner that enables heat-transfer therebetween so that heat generated by the first electronic component mounted on a substrate is absorbed thereby; and a vibrating capillary-shaped heat-pipe loop comprising a first heat-absorption portion coupled with the thermal base in such a manner that enables heat-transfer therebetween and a heat-dissipating portion configured to dissipate heat absorbed by the first heat-absorption portion, the heat-pipe loop having working fluid injected thereinto. The heat-pipe loop can be radially disposed with a central area thereof hollowed out, and an assembly area of a coupling member can be exposed in the central area so that the coupling member for coupling the thermal base to the substrate is coupled through the central area.

Inventors: Lee; Sang-Cheol (Gyeonggi-do, KR)

Assignee: Icepipe Corporation

International Classification: H05K 7/20 (20060101); F28D 15/00 (20060101); G06F 1/20 (20060101)

Expiration Date: 2019-11-04 0:00:00