Patent Number: 8,879,297

Title: Semiconductor device having multi-level wiring structure

Abstract: Disclosed herein is a device that includes a multi-level wiring structure including a first wiring layer and a second wiring layer formed over the first wiring layer; a memory cell array area including a plurality of memory cells, a plurality of sense amplifiers and a plurality of sub amplifiers; a main amplifier area including a plurality of main amplifiers, the memory cell array area and the main amplifier area being arranged in line in a first direction; and a plurality of first I/O lines each connecting an associated one of the sub amplifiers to an associated one of the main amplifiers, each of the first I/O lines including first and second wiring portions that are elongated in the first direction, the first wiring portion being formed as the first wiring layer and the second wiring portion being formed as the second wiring layer.

Inventors: Egawa; Hidekazu (Tokyo, JP)

Assignee: PS4 Luxco S.a.r.l.

International Classification: G11C 7/10 (20060101)

Expiration Date: 2019-11-04 0:00:00