Patent Number: 9,384,439

Title: Semiconductor device and communication system

Abstract: It is an object of the present invention to provide a semiconductor device in which a sophisticated integrated circuit using a polycrystalline semiconductor is formed over a substrate which is weak with heat such as a plastic substrate or a plastic film substrate and a semiconductor device which transmits/receives power or a signal without wires, and a communication system thereof. One feature of the invention is that a semiconductor device, specifically, a processor, in which a sophisticated integrated circuit is fixed to a plastic substrate which is weak with heat by a stripping method such as a stress peel of process method to transmit/receive power or a signal without wires, for example, with an antenna or a light receiving element.

Inventors: Yamazaki; Shunpei (Setagaya, JP), Kato; Kiyoshi (Atsugi, JP)

Assignee: Semiconductor Energy Laboratory Co., Ltd.

International Classification: G06K 19/06 (20060101); G06K 19/077 (20060101); H01L 27/12 (20060101)

Expiration Date: 2020-07-05 0:00:00