Patent Number: 9,433,132

Title: Recirculating dielectric fluid cooling

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

Inventors: Krishnan; Shankar (Portland, OR), McAfee; Eric D. (Portland, OR), Byquist; Tod A. (Federal Way, WA)

Assignee: Intel Corporation

International Classification: H05K 7/20 (20060101); H01L 23/473 (20060101)

Expiration Date: 2020-08-30 0:00:00