Patent Number: 9,970,114

Title: Shielding coating for selective metallization

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain polyamines and the top coat contains hydrophobic alky organic compounds.

Inventors: Chan; Hung Tat (Tin Shui Wai, HK), Yip; Ka Ming (Tai Wai, HK), Chan; Chit Yiu (Shatin, HK), Yee; Kwok Wai (Yuen Long, HK)

Assignee: Rohm and Haas Electronic Materials LLC

International Classification: H01B 13/00 (20060101); C23C 18/16 (20060101); C23C 18/38 (20060101); B05D 5/08 (20060101); B05D 1/18 (20060101); B05D 1/02 (20060101); C08J 7/04 (20060101); B05D 5/06 (20060101); C23C 18/20 (20060101); B05D 3/06 (20060101); B05D 3/00 (20060101); C23C 18/22 (20060101); C09K 13/00 (20060101); C23C 18/18 (20060101)

Expiration Date: 2022-05-15 0:00:00