Patent Number: H1,933

Title: Magnetron sputter-pulsed laser deposition system and method

Abstract: System and method for high vacuum sputtering combining magnetron sputtering and pulsed laser plasma deposition are described wherein simultaneous or sequential magnetron sputtering and pulsed laser deposition operations in a single ultra-high vacuum system provides high deposition rates with precise control of film morphology, stoichiometry, microstructure, composition gradient, and uniformity, in the deposition of high performance coatings of various metal, ceramic and diamond-like carbon materials.

Inventors: Zabinski; Jeffrey S. (Dayton, OH), Voevodin; Andrey A. (Kettering, OH), Donley; Michael S. (Dayton, OH)

Assignee: The United States of America as represented by the Secretary of the Air Force

International Classification: C23C 14/22 (20060101); C23C 14/28 (20060101); C23C 14/35 (20060101); C23C 014/34 ()

Expiration Date: 01/02/2018